AMD's high core count processor, 64-core, 8-channel (memory), 4094 contact 1 mm pitch in LGA  measuring 58.5 mm × 75.4 mm

To pack even more bits per unit area, NAND flash memory cells are arranged in vertical tubes then made 64 or 96 layers of cells. 1 cm die can have 50,000 x 50,000 tubes, 96 layers to make cells that store 3 bits each, totaling 10 GB storage. 16 such dies can be stacked to get 1.5 TB memory and the total thickness is still less than 1 millimeter

A blockchain is a secure, digital ledger of data, organized in blocks that are linked together sequentially (hence the name). Links in the blockchain are completely secure and unbreakable. Once you add a link, it cannot be changed, moved, or deleted. Blockchains are decentralized and distributed; parties can share data and execute transactions, with full security, without having to rely on any central authority or service provider to act as a clearing house. The data on a block can be more than a simple ledger of facts; it can contain something called a “smart contract”, which allow you to put instructions on the blockchain for execution at a later date

University of Alabama in Huntsville, in the north part of Alabama, USA. Well know engineering higher education institute ranking 58 nationwide. It is space grant college sponsored by NASA, and the home of: NASA's Space Museum, NASA's Marshall Space Flight Center, Redstone Arsenal, US Army Aviation and Missile Command, Strategic Defense Initiative, Toyota and Mazda auto makers, InterGraph, ADTRAN and the  Cummings Research Park which is the 2nd nationwide and 3rd worldwide. This where enjoyed 6 years of my life to get my MS and PhD diplomas

Electronic grade silicon ingot is almost defect free, with purity 99.9999999% (AKA, 9 Nines or 9N), with diameters of 15, 20, 30 cm (45 cm proposed). The weight depends on the length and diameter and could go 500 Kg. Ingots are crystalized from melting Silicon. Wafers are cut using special wire saws to control thickness of a fraction of millimeter

Silicon wafers are cut out of silicon ingot with diameters of 10, 15, 20 or 30 cm (45 cm wafers are proposed to reduce cost by increasing throughput). After being cut, wafers go through too many processes like polishing, lithography, doping, etching, and at the end cutting dies and testing them, to package the good ones. The number of dies depends on how small the die is and how large the war is. Typically from several tens to several hundreds

The die is the active part of the chip, where billions (up to 50 today) of transistors and miles of connecting wires are. the first die was created in 1971 by Intel with 2300 transistors, and today some dies have billions transistors. Small dies are few millimeters wide (down to 6 mm) and large ones are several millimeters wide (up to 24 mm)

Intel's Lakefield 3D chip stacks two layers of DRAM, a chillest of 5 cores CPU and GPUs, on top of a base die with large cache and I/O

The Central Processing Unit (CPU), also know as processor or microprocessor, is a silicon chip with millions to billions of transistors working as logic gates to act like switches, It is the main component of any microprocessor system or controller. Price depends of performance which varies significantly from. High performance systems may include multiple CPUs and each CPU may have ten's of cores

The clean room is where engineers that supervise the chip making control the processes. Clean rooms are hundreds of times cleaner than surgery rooms and can afford a virus like particles to get in. Clean rooms cost several billions of dollars to build, and to make a chip, it takes more than 1500 steps over more than 6 weeks